Apparatus and method for probing device-under-test
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChuan-Hsiang Sun, Bo-You Chen, Chi-Chang Lai, Hsiou-Yu He, Peiwei Lin
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AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChuan-Hsiang Sun, Bo-You Chen, Chi-Chang Lai, Hsiou-Yu He, Peiwei Lin
Estimating the term…
An apparatus for probing a device-under-test (DUT) includes a fixture disposed over the DUT, a circuitry film disposed along a contour of the fixture, a first signal connector, and a plurality of probing tips disposed on the circuitry film and extending toward the device-under-test. The circuitry film includes a first portion attached to a top sidewall of the fixture, and the first signal connector is disposed on and electrically connected to the first portion of the circuitry film. The first signal connector is electrically coupled to the probing tips through the circuitry film. A method for probing a DUT is also provided.
An apparatus for probing a device-under-test, comprising:
An apparatus for probing a device-under-test, comprising:
A method for probing a device-under-test, comprising:
Dependencies are inferred from the claim text.