Substrate processing apparatus and the method thereof
AssigneeSemes Co., Ltd.
InventorsSung Ho KIM, Yoon Ok Jang, Bo Yeon Hwang, Hyun Min Lee, Kwang Jun Choi
Life of this patent
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AssigneeSemes Co., Ltd.
InventorsSung Ho KIM, Yoon Ok Jang, Bo Yeon Hwang, Hyun Min Lee, Kwang Jun Choi
Estimating the term…
A substrate processing apparatus and a substrate processing method are provided, which can improve the yield by minimizing the occurrence of stains. The substrate processing method includes forming on the substrate a plurality of ink patterns spaced apart from each other by jetting ink onto the substrate by using a plurality of nozzles, calculating the density of each of the plurality of ink patterns, and selecting at least one nozzle for jetting ink into one pixel area based on respectively calculated densities of the plurality of ink patterns.
A method of processing a substrate, comprising:
An apparatus for processing substrates, the apparatus comprising:
An apparatus for processing one or more substrates, comprising:
Dependencies are inferred from the claim text.