Leadframe with varying thicknesses and method of manufacturing semiconductor packages

A method, comprising:

• forming a plurality of layers on a first layer of a leadframe, forming the plurality of layers including:
• forming a second layer on a first region along a first side of the first layer of a leadframe;
• forming a third layer on a second region along a second side of the first layer of the leadframe, the second region being opposite to the first region and overlapping the first region;
• forming a fourth layer on a third region, a fourth region, and a fifth region along the second side of the first layer of the leadframe and extending into a first recess of the leadframe partially filling the first recess with the fourth layer, the fourth region being transverse to the third region and the fifth region, the fourth region extending from the third region to the fifth region;
• and
• forming a fifth layer on a sixth region on the first side of the first layer of the leadframe, the sixth region being opposite to the third region and overlapping the third region, the fifth layer being spaced apart from the second layer;
• forming a second recess into the first layer of the leadframe between the first layer and the fifth layer;
• coupling a die by an adhesive to the second layer;
• after coupling the die to the second layer, forming a molding compound entirely covering the first side of the first layer of the leadframe, covering the die, covering the fifth layer, and filling the second recess;
• and
• after forming the molding compound, singulating a portion of the first layer, a portion the fourth layer, an extension of the leadframe extending between a first lead portion and a second lead portion of the leadframe, and the molding compound aligned with and overlapping the first recesses forming a semiconductor package.

A device, comprising:

• a leadframe including:
• a die pad having a surface;
• a first lead having:
• a first layer including:
• a first portion extending in a first direction;
• a second portion extending away from the first portion in a second direction transverse to the first portion;
• a third portion extending away from the second portion in the first direction;
• a first internal surface and a first external surface extending in the first direction, the first portion being between the first internal surface and the first external surface;
• a second internal surface and a second external surface extending in the second direction, the second portion being between the second internal surface and the second external surface;
• a third internal surface and a third external surface extending in the first direction, the third portion being between the third internal surface and the third external surface;
• and
• a first end surface extending in the first direction from the third internal surface to the third external surface;
• a die coupled to the surface of the die pad by an adhesive;
• and
• a molding compound covering the first internal surface, the second internal surface, and the third internal surface, the molding compound including a first sidewall surface substantially coplanar with the first end surface of the first layer of the first lead.