Semiconductor structure and method of forming the same

A method of forming a semiconductor structure, comprising:

• providing a functional die, a first dummy die and a second dummy die, the first dummy die being between the functional die and the second dummy die;
• encapsulating the functional die, the first dummy die and the second dummy die by an insulating material;
• forming a first alignment mark over the first dummy die and a second alignment mark over the second dummy die;
• and
• cutting the insulating material along a sawing line between the first alignment mark and the second alignment mark, to separate the functional die and the first dummy die from the second dummy die.

A method of forming a semiconductor structure, comprising:

• forming a plurality of functional dies, a plurality of first dummy dies and a plurality of second dummy dies, wherein the plurality of first dummy dies and the plurality of second dummy dies are disposed at opposite sides of a sawing region;
• encapsulating the plurality of functional dies, the plurality of first dummy dies and the plurality of second dummy dies by an insulating material;
• forming a plurality of pairs of alignment marks, the plurality of pairs of alignment marks comprising a plurality of first alignment marks over the plurality of first dummy dies and a plurality of second alignment marks over the plurality of second dummy dies;
• determining a position of a sawing line in the sawing region by identifying the plurality of pairs of alignment marks;
• and
• performing a sawing process along the sawing line.