Semiconductor etching device
AssigneeChangxin Memory Technologies, Inc.
InventorChin-Kuan LIN
Life of this patent
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Abstract
An embodiment of the present application provides a semiconductor etching device, comprising: an air delivery chamber (21), configured to accommodate a wafer (22) to be etched; an air intake module (23), configured to feed air into the air delivery chamber (21); an air exhaust module, configured to exhaust air in the air delivery chamber (21), the air exhaust module comprising an airlock (27) and a wind speed measurement and control unit (28), the wind speed measurement and control unit (28) being configured to detect an air flow rate in the air delivery chamber (21) and adjust the degree of opening of the airlock (27) based on the air flow rate.
Claims11
A semiconductor etching device, comprising:
- an air delivery chamber, configured to accommodate a wafer to be etched;
- an air intake module, configured to feed air into the air delivery chamber;
- and
- an air exhaust module, configured to exhaust air in the air delivery chamber, the air exhaust module comprising an airlock and a wind speed measurement and control unit, the wind speed measurement and control unit being configured to detect an air flow rate in the air delivery chamber and adjust a degree of opening of the airlock based on the air flow rate.
Dependencies are inferred from the claim text.