System and method for high speed inspection of semiconductor substrates

A method of manufacturing a semiconductor device, comprising:

• transmitting a first beam of light from a first illumination source;
• transmitting a second beam of light from a second illumination source;
• generating two or more third beams of light from the first beam of light and the second beam of light, wherein the generating the two or more third beams of light comprises splitting one of the first beam of light, splitting the second beam of light, or splitting both;
• impinging the two or more third beams of light onto a set of two or more first locations on top of a semiconductor substrate;
• in response to the impinged two or more third beams of light, receiving two or more reflected beams of light from the set of two or more first locations;
• detecting the received two or more reflected beams of light;
• generating two or more detected signals based on the two or more reflected beams of light;
• analyzing the two or more detected signals;
• and
• determining, based on the analysis, if a defect exists at the set of two or more first locations.

An inspection system for semiconductor substrates, comprising:

• a control system that comprises a main controller and an analyzer module;
• an illumination system that comprises one or more illumination sources;
• a beam splitter system optically coupled to the illumination system and configured to receive a first beam of light from a first illumination source of the illumination system, wherein the beam splitter system is configured to split the first beam of light and to generate two or more second beams of light, wherein the beam splitter system is configured to transmit the two or more second beams of light to impinge onto two or more first locations on top of a semiconductor substrate;
• and
• two or more beam splitters and two or more light detection systems, wherein each one of the two or more beam splitters is optically coupled to a separate light detection system, wherein each one of the two or more light detection systems is configured to receive, through a corresponding beam splitter, a separate reflected beam of light from one of the two or more first locations, wherein each one of the two or more light detection systems are configured to generate a detected signal based on the received reflected beam of light,
• wherein the two or more light detection systems are coupled to the control system and the analyzer module of the control system is configured to receive two or more detected signals, wherein the analyzer module is configured to determine if a defect exists at the two or more first locations based on the two or more detected signals.