Leadframe-less laser direct structuring (lds) package

A method, comprising:

• coupling a plurality of die to a first side of a resin wafer that includes a first additive material;
• exposing a second side of the resin wafer opposite to the first side to a laser including:
• forming a boundary recess extending into the second side of the resin wafer activating the first additive material along and within the boundary recess;
• forming a plurality of recesses extending into the second side of the resin wafer surrounded by the boundary recess and activating the first additive material along and within the recesses;
• and
• forming a plurality of channels extending in a first direction extending across corresponding ones of the plurality of recesses and extending from a first portion of the boundary recess extending in a second direction transverse to the first direction to a second portion of the boundary recess extending in the second direction, forming the plurality of channels including activating the first additive material along and within the plurality of channels;
• and
• forming a first conductive layer in the boundary recess, the plurality of channels, and the plurality of recesses extending continuously along the plurality of channels and the boundary recess.

A device, comprising:

• a first layer of resin having a first additive material, the first layer having a first thickness, the first layer having a first surface and a second surface opposite to the first surface;
• a die on the second surface of the first layer;
• a second layer of resin having a second additive material on the second surface of the first layer of resin, the second layer covers the die, the second layer having a third surface facing away from the first layer, the second layer having a second thickness extending from the second surface to the third surface;
• a first lead exposed from the first surface;
• a first conductive via extending from the first lead to the third surface of the second layer;
• a second conductive via extending into the third surface to the die;
• a bus bar extending from the first conductive via to the second conductive via, the bus bar coupling the first conductive via to the second conductive via;
• and
• a third layer of resin on the third surface of second layer, the third layer covers respective surfaces of the bus bar, the first conductive via, and the second conductive via, respectively, exposed from the third surface of the second layer, the third layer having a third thickness less than the first thickness and less than the second thickness.