Semiconductor package and method of manufacturing same

A semiconductor package comprising:

• a first redistribution structure including first redistribution conductors;
• a semiconductor chip on the first redistribution structure and including connection pads electrically connecting the first redistribution conductors;
• a connection conductor on the first redistribution structure, laterally spaced apart from the semiconductor chip, and electrically connecting the first redistribution conductors;
• an encapsulant on the first redistribution structure and sealing the semiconductor chip and at least a portion of the connection conductor;
• a barrier layer on the encapsulant;
• and
• a second redistribution conductor electrically connected to the first redistribution conductor through the connection conductor and including a pattern portion on the barrier layer, and a via portion penetrating through the barrier layer and extending from the pattern portion towards the connection conductor.

A semiconductor package comprising:

• a first redistribution structure including first redistribution conductors;
• a semiconductor chip on the first redistribution structure and including connection pads electrically connected to the first redistribution conductors;
• a connection conductor on the first redistribution structure, laterally spaced apart from the semiconductor chip, and including a first seed layer and a first plating layer on the first seed layer;
• an encapsulant sealing the semiconductor chip and at least a portion of the connection conductor;
• a barrier layer extending along an upper surface of the encapsulant;
• and
• a second redistribution conductor on the barrier layer, penetrating through the barrier layer to contact the connection conductor, and including a second seed layer and a second plating layer on the second seed layer.