Integrated circuit device, method and system

A method of manufacturing an integrated circuit (IC) device, the method comprising:

• depositing a lower metal layer over a substrate having thereon a plurality of transistors;
• patterning the lower metal layer to form a plurality of lower conductive patterns elongated along a first axis;
• depositing an upper metal layer over the lower metal layer;
• and
• patterning the upper metal layer to form
• a plurality of upper conductive patterns elongated along a second axis transverse to the first axis, and
• a first lateral upper conductive pattern contiguous with and projecting, along the first axis, from a first upper conductive pattern among the plurality of upper conductive patterns.

A system, comprising:

• at least one processor;
• and
• at least one memory that stores computer program code for one or more programs,
• wherein
• when the at least one processor executes the computer program code stored in the at least one memory, the computer program code and the at least one processor are configured to cause the system to generate a layout diagram of an integrated circuit (IC) device, the layout diagram being stored on a non-transitory computer-readable medium,
• the generating the layout diagram comprises placing a first cell in abutment with a second cell in the layout diagram, and
• at least one of the first cell or the second cell comprises:
• a plurality of active regions;
• a plurality of gate regions over and transverse to the plurality of active regions;
• a lower metal layer over the plurality of gate regions;
• and
• an upper metal layer over the lower metal layer, the upper metal layer comprising an L-shaped or bracket-shaped upper conductive pattern.