Package structure with antenna circuit
AssigneeJabil Circuit (Singapore) Pte. Ltd.
InventorsChi-Neng Ho, Sheng-Wen Ni, Yu-Cheng Lin, Yen-Chou Chen
Life of this patent
Estimating the term…
Abstract
A package structure includes a carrier substrate, a circuit unit, and a packaging unit. The circuit unit includes an antenna circuit, and a conducting circuit that is flexible and that is electrically connected to the antenna circuit. At least a portion of the antenna circuit is disposed on the carrier substrate. The packaging unit is disposed on the carrier substrate by molding and encapsulates the circuit unit such that a portion of the circuit unit is exposed to permit said conducting circuit for electrical connection with the outside.
Claims12
A package structure comprising:
- a carrier substrate that is insulating and flexible;
- a circuit unit including an antenna circuit, and a conducting circuit that is flexible and that is electrically connected to said antenna circuit, at least a portion of said antenna circuit being disposed on said carrier substrate;
- and
- a packaging unit disposed on said carrier substrate by molding and encapsulating said circuit unit such that a portion of said circuit unit is exposed to permit said conducting circuit for electrical connection with the outside.
A package structure comprising:
- a carrier substrate that is insulating and flexible;
- a circuit unit including an antenna circuit, a conducting circuit that is flexible and that is electrically connected to said antenna circuit, a printed circuit board that is flexible, and a conductive adhesive member, wherein said antenna circuit is disposed on said carrier substrate, said conducting circuit is formed on said printed circuit board, and said conductive adhesive member is formed on a portion of a surface of said antenna circuit for connecting said antenna circuit to said conducting circuit;
- and
- a packaging unit disposed on said carrier substrate by molding and encapsulating said circuit unit such that said conducting circuit is partially exposed for electrical connection with the outside.
A package structure comprising:
- a carrier substrate that is insulating and flexible;
- a circuit unit including a printed circuit board that is flexible, an antenna circuit, and a conducting circuit electrically connected to said antenna circuit, said printed circuit board being partially connected to said carrier substrate and having one side that is bent, said antenna circuit being at least partially formed on said printed circuit board in a range where said printed circuit board is connected to said carrier substrate, said conducting circuit being formed on said printed circuit board at said one side that is bent;
- and
- a packaging unit disposed on said carrier substrate by molding and encapsulating said circuit unit such that said one side of said printed circuit board that is bent and a portion of said circuit unit are exposed to permit said conducting circuit for electrical connection with the outside.
Dependencies are inferred from the claim text.