Semiconductor devices and methods of manufacturing thereof
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsSung-Hsin Yang, Jung-Chi Jeng, Ru-Shang Hsiao
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AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsSung-Hsin Yang, Jung-Chi Jeng, Ru-Shang Hsiao
Estimating the term…
A semiconductor device includes a semiconductor substrate. The semiconductor device includes a first three-dimensional semiconductor structure of a first conductivity type protruding from a surface of the semiconductor substrate. The semiconductor device includes a second three-dimensional semiconductor structure of a second conductivity type protruding from the surface of the semiconductor substrate. The semiconductor device includes a first transistor having a first source/drain structure formed in the first three-dimensional semiconductor structure, a second source/drain structure formed in the second three-dimensional semiconductor structure, a first gate structure straddling a first portion of the first three-dimensional semiconductor structure and a first portion of the second three-dimensional semiconductor structure, and a second gate structure straddling a second portion of the second three-dimensional semiconductor structure.
A semiconductor device, comprising:
A semiconductor device, comprising:
A method for making a semiconductor device, comprising:
Dependencies are inferred from the claim text.