Damper system for a lidless integrated circuit
AssigneeArista Networks, Inc.
InventorsRobert Morris Wilcox, Tiffany Doria, Steven Alf Hanssen
Life of this patent
Estimating the term…
Abstract
A processing unit. The processing unit includes a printed circuit board (PCB) including a lidless integrated circuit, a heatsink, and a damper system. The heatsink is coupled to the PCB and in thermal communication with the lidless integrated circuit via a thermal interface material. The damper system is compressed between the PCB and the heatsink and surrounding the lidless integrated circuit to absorb a portion of kinetic energy imparted to the lidless integrated circuit by an impact to the processing unit.
Claims20
A processing unit comprising:
- a printed circuit board (PCB) comprising a lidless integrated circuit;
- a heatsink in thermal communication with the lidless integrated circuit via a thermal interface material;
- and
- a damper system compressed between the PCB and the heatsink and surrounding the lidless integrated circuit to absorb a portion of kinetic energy imparted to the lidless integrated circuit by an impact to the processing unit.
A damper system for use with a heatsink and a PCB comprising a lidless integrated circuit, wherein:
- the damper system is positionable between the PCB and the heatsink and to surround the lidless integrated circuit;
- and
- the damper system, when compressed between the PCB and the heatsink, absorbs a portion of kinetic energy imparted to the lidless integrated circuit by an impact to at least one of the heatsink or the PCB.
A compute unit comprising:
- a chassis;
- a processing unit positioned within the chassis and comprising:
- a printed circuit board (PCB) comprising a lidless integrated circuit;
- a heatsink in thermal communication with the lidless integrated circuit via a thermal interface material;
- and
- a damper system compressed between the PCB and the heatsink and surrounding the lidless integrated circuit to absorb a portion of kinetic energy imparted to the lidless integrated circuit by an impact to the processing unit;
- and
- an air mover unit positioned within the chassis and operable to flow air over the heatsink.
Dependencies are inferred from the claim text.