Package structure and method of forming the same

A package structure, comprising:

• a die, having a first surface;
• an encapsulation layer, encapsulating a sidewall of the die;
• a redistribution layer structure, disposed on the encapsulation layer and defining an opening that exposes a portion of the first surface of the die;
• and
• a sealing protection structure, disposed on the die and along a sidewall of the opening defined by the redistribution layer structure.

A method of forming a package structure, comprising:

• attaching a die to a carrier, wherein the die has a passivation layer on a first side thereof;
• forming an encapsulation layer to encapsulate a sidewall of the die;
• forming a redistribution layer structure on the encapsulation layer and the die, wherein the redistribution layer structure is in physical contact with a portion of the passivation layer of the die;
• and
• forming a sealing protection structure to cover at least an interface between the redistribution layer structure and the passivation layer.