US 2023/0067259 A1Published application

Heat-curable resin composition

AssigneeShin-Etsu Chemical Co., Ltd.

InventorsNaoyuki KUSHIHARA, Rina SASAHARA

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Abstract

Provided is a heat-curable resin composition capable of being turned into a cured product having a low relative permittivity, a low dielectric tangent, an excellent adhesiveness and a high resistance. The heat-curable resin composition contains: (A) a citraconimide compound; (B) an epoxy resin; (C) an epoxy resin curing agent; and (D) a curing accelerator.

Claims10

Dependent claims

A heat-curable resin composition comprising:

(A) a citraconimide compound;
(B) an epoxy resin;
(C) an epoxy resin curing agent;
and
(D) a curing accelerator.

2 more elements

Dependencies are inferred from the claim text.

Facts

Application: 17/869,197Filed 20 Jul 2022
Priority: JP 2021-1264222 Aug 2021
Published: 2 Mar 2023
Term ends: Not estimatedThe source records don’t support an estimate.

Classification6 codes

C08F 283/10
Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G: on to polymers containing more than one…
C09D 151/08
Coating compositions based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated…:…
C09J 151/08
Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds ;…:…
C08F
Macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds

Family

US 12,110,356 B2Related patent
US 2023/0067259 A1This patent

From the US filing history. Foreign family members aren’t listed.

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