Vapor chamber structure

A vapor chamber structure, comprising:

• a thermally conductive shell comprising a first thermally conductive portion and a second thermally conductive portion, wherein the first thermally conductive portion and the second thermally conductive portion are a thermally conductive plate that is integrally formed, and the thermally conductive shell is formed by folding the thermally conductive plate in half and then sealing the thermally conductive plate, wherein the first thermally conductive portion has at least one first cavity, the second thermally conductive portion has at least one second cavity, and at least one sealed chamber is defined between the thermally conductive plate, the at least one first cavity, and the at least one second cavity, and an extension direction of the at least one first cavity is different from an extension direction of the at least one second cavity, wherein a pressure in the at least one sealed chamber is lower than a standard atmospheric pressure;
• a capillary structure layer covering an inner wall of the at least one sealed chamber, wherein the capillary structure layer comprises a first capillary structure portion and a second capillary structure portion, the first capillary structure portion at least covers an inner wall of the at least one first cavity, and the second capillary structure portion is configured on the second thermally conductive portion and at least covers an inner wall of the at least one second cavity;
• and
• a working fluid filled in the at least one sealed chamber.