Substrate analysis apparatus and substrate analysis method

A substrate analysis apparatus comprising:

• an exchange module configured to transfer a wafer between a process chamber and an analysis chamber;
• a pre-processing module which is provided on a bottom surface of the analysis chamber and configured to form a test wafer piece using the wafer;
• an analysis module which is provided on the bottom surface of the analysis chamber and configured to analyze the test wafer piece;
• and
• a transfer rail which is provided on a ceiling of the analysis chamber and configured to transport the wafer from the exchange module to the pre-processing module, and a tray containing the test wafer piece from the pre-processing module to the analysis module.

A substrate analysis method comprising:

• transferring a first Front Opening Unified Pod (FOUP) in which a plurality of wafers are stored, using an interlayer conveying module provided in a first region of a substrate analysis apparatus, information about a wafer, from among the plurality of wafers, being stored in a first identifier;
• transferring the wafer from the first region to a second region of the substrate analysis apparatus different from the first region, using an exchange module connected to the interlayer conveying module, the wafer being stored in a second FOUP inside the exchange module;
• transferring the wafer from the exchange module to a pre-processing module along a transfer rail provided in the second region;
• forming a test wafer piece using the pre-processing module;
• generating a second identifier indicating information corresponding to the test wafer piece;
• placing the test wafer piece in a tray;
• transferring the tray containing the test wafer piece to an analysis module along the transfer rail;
• analyzing the test wafer piece, using the analysis module;
• and
• analyzing the first identifier and the second identifier in connection with each other.