Semiconductor die package with ring structure and method for forming the same

A semiconductor die package, comprising:

• a package substrate;
• an interposer substrate disposed over the package substrate;
• a first semiconductor die and a second semiconductor die disposed over the interposer substrate;
• an underfill element formed over the interposer substrate and surrounding the first and second semiconductor dies, wherein a portion of the underfill element is between the first semiconductor die and the second semiconductor die;
• at least a stress-relief structure disposed over the package substrate and surrounding the first and second semiconductor dies, wherein the stress-relief structure includes a first flat plate facing the package substrate, a second flat plate opposite the first flat plate, a plurality of connection parts connecting the first and second flat plates, and a plurality of hollow parts between the first flat plate, the second flat plate, and the connection parts, and
• wherein the hollow parts comprise a plurality of first hollow parts arranged in at least one corner area of the stress-relief structure;
• and
• an adhesive layer interposed between the first flat plate of the stress-relief structure and the package substrate.

A semiconductor die package, comprising:

• a package substrate;
• an interposer substrate disposed over the package substrate;
• a first semiconductor die and a second semiconductor die disposed over the interposer substrate;
• an underfill element formed over the interposer substrate and surrounding the first and second semiconductor dies, wherein a portion of the underfill element is between the first semiconductor die and the second semiconductor die;
• a ring structure disposed over the package substrate and surrounding the first and second semiconductor dies, wherein the ring structure has a bottom surface facing the package substrate and a plurality of recessed parts recessed from the bottom surface,
• wherein the recessed parts comprise a plurality of first recessed parts arranged in at least one corner area of the ring structure and two second recessed parts arranged in two opposite side areas of the ring structure, and
• wherein the portion of the underfill element between the first and the second semiconductor dies is disposed between the two second recessed part;
• and
• an adhesive layer interposed between the bottom surface of the ring structure and the package substrate, wherein the adhesive layer partially extends into the recessed parts.