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US 2023/0066652 A1Published application
Semiconductor device packaging warpage control
AssigneeNXP USA, Inc.
InventorsVivek Gupta, Michael B. Vincent, Scott M. Hayes, Richard Te Gan, Zhiwei Gong
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Abstract
A method of manufacturing a carrier for semiconductor device packaging is provided. The method includes forming a carrier having a plurality of plateau regions separated by a plurality of channels. The carrier is configured and arranged to support a plurality of semiconductor die during a packaging operation. The plurality of channels is filled with a material configured to control warpage of the carrier.
Claims20
A method comprising:
- forming a carrier having a plurality of plateau regions separated by a plurality of channels, the carrier configured and arranged to support a plurality of semiconductor die during a packaging operation;
- and
- filling the plurality of channels with a structural material, the structural material configured to control warpage of the carrier.
An apparatus for manufacturing a packaged semiconductor device, the apparatus comprising:
- a carrier having a plurality of plateau regions separated by a plurality of channels, the carrier configured and arranged to support a plurality of semiconductor die during a packaging operation;
- and
- a structural material disposed in the plurality of channels, the structural material configured to control warpage of the carrier.
A method comprising:
- forming a carrier having a plurality of vertical channels and a plurality of horizontal channels, the plurality of vertical channels and the plurality of horizontal channels configured and arranged to separate a plurality of plateau regions of the carrier;
- and
- filling the plurality of vertical channels and the plurality of horizontal channels with a structural material, the structural material configured to control warpage of the carrier during a packaging operation.
Dependencies are inferred from the claim text.