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US 2023/0066587 A1Published application
Memory placement in a computing system
AssigneeMicron Technology, Inc.
InventorsJames S. Rehmeyer, Christopher G. Wieduwilt
Life of this patent
Estimating the term…
Abstract
Apparatuses and methods can be related to placing memory in a computing system. The memory modules can be placed in memory slots to couple the memory modules to the computing system. The memory modules and/or the memory slots can have thermal qualities which can be utilized to determine which of the memory modules are placed on which of the memory slots.
Claims22
A computing system, comprising:
- a substrate having a surface, the surface having a first memory slot and a second memory slot, wherein the first memory slot comprises a first region and a second region and the second memory slot comprises a third region and a fourth region and wherein the first region and the second region are cooler than the third region and the fourth region during operation;
- a first memory module attached to the substrate in the first memory slot,
- wherein the first memory module has a first performance rating and a second performance rating of an operating parameter affected by temperature, and
- wherein the first performance rating corresponds to a first region of the first memory module aligned with the first region of the first memory slot and the second performance rating corresponds to a second region of the first memory module aligned with the second region of the first memory slot;
- and
- a second memory module attached to the substrate in the second memory slot,
- wherein the second memory module has a third performance rating and a fourth performance rating of the operating parameter affected by temperature indicating that the second memory module operates more effectively than the first memory module at higher temperatures, and
- wherein the third performance rating corresponds to a third region of the second memory module aligned with the third region of the second memory slot and the fourth performance rating corresponds to a fourth region of the second memory module aligned with the fourth region of the second memory slot.
5 more elements
An apparatus, comprising:
- a substrate having a surface, the surface having a first memory slot and a second memory slot, wherein the first memory slot is cooler than the second memory slot during operation;
- a first memory module attached to the substrate in the first memory slot,
- wherein the first memory module has a first performance rating of an operating parameter affected by temperature, and
- a second memory module attached to the substrate in the second memory slot,
- wherein the second memory module has a second performance rating of the operating parameter affected by temperature indicating that the second memory module operates more effectively than the first memory module at higher temperatures.
2 more elements
A computing system, comprising:
- a substrate having a surface, the surface having a first mount and a second mount, wherein the first mount is cooler than the second mount during operation;
- a first memory package attached to the substrate in the first mount, wherein the first memory package has a first performance rating and a second performance rating of an operating parameter affected by temperature;
- and
- a second memory package attached to the substrate in the second mount, wherein the second memory package has a third performance rating and a fourth performance rating of the operating parameter indicating that the second memory package operates more effectively than the first memory package at higher temperatures.
1 more element
Dependencies are inferred from the claim text.