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US 2023/0066554 A1Published application
Electronic package and method for manufacturing the same
AssigneeNexperia B.V.
InventorQingyuan Tang
Life of this patent
Estimating the term…
Abstract
An electronic package having a miniaturized footprint and a method for manufacturing the same is provided. Due to the arrangement of bottom contacts of the electronic package using a first partial vias, a footprint is obtained that is miniaturized with respect to the known electronic package comprising a same-sized electronic component. The electronic package according to the present disclosure enables packaging multiple electronic components while nevertheless minimally increasing the footprint with respect to conventional electronic packages.
Claims18
An electronic package comprising:
- a first substrate comprising a first dielectric layer;
- a second substrate comprising a second dielectric layer, the second substrate being mutually fixated relative to the first substrate;
- a first electronic component arranged in between the first and second substrate, the first electronic component having a plurality of first terminals;
- and
- a plurality of first inner contacts, each first inner contact being arranged on the first dielectric layer or the second dielectric layer;
- wherein each first terminal among the plurality of first terminals is electrically connected to at least one first inner contact among the plurality of first inner contacts, and wherein each first inner contact among the plurality of first inner contacts is electrically connected to at least one first terminal among the plurality of first terminals;
- wherein the electronic package further comprises a plurality of first partial vias, each first partial via having a side wall and being arranged in the first or second dielectric layer, wherein each first inner contact among the plurality of first inner contacts is electrically connected to at least one first partial via among the plurality of first partial vias, wherein the side wall of each first partial via among the plurality of first partial vias, and/or a metal contact layer arranged on the side wall, forms at least part of a first bottom contact of the electronic package and forms at least part of a mounting surface of the electronic package.
4 more elements
A method for manufacturing an electronic package, the method comprising the steps of:
- providing a first substrate comprising a first dielectric layer and a second substrate comprising a second dielectric layer, wherein each of a plurality of first inner contacts is arranged on the first dielectric layer or the second dielectric layer, wherein each of a plurality of first vias is arranged in the first dielectric layer or the second dielectric layer, and wherein each first inner contact among the plurality of first inner contacts is electrically connected to at least one first via among the plurality of first vias;
- arranging a first electronic component in between the first and second substrate, the first electronic component comprising a plurality of first terminals, each first terminal among the plurality of first terminals being electrically connected to at least one first inner contact among the plurality of first inner contacts, and each first inner contact among the plurality of first inner contacts being electrically connected to at least one first terminal among the plurality of first terminals;
- mutually fixating the first and second substrates, thereby defining a package body comprising a package portion in which the plurality of first inner contacts and the first electronic component are arranged;
- performing a separating action along a separating surface extending through the plurality of first vias, thereby:
- separating the package portion from a remainder of the package body;
- forming a plurality of first partial vias, each first partial via having a side wall, and wherein the side wall of each first partial via among the plurality of first partial vias, and/or a metal contact layer arranged on the side wall, forms at least part of a first bottom contact of the electronic package and forms at least part of a mounting surface of the electronic package.
3 more elements
Dependencies are inferred from the claim text.