Device assembly, device module including the device assembly, and device package including the device module

Abstract

Provided is a device assembly including a substrate for mounting a device thereon, electrodes provided on the substrate to be electrically connected to the device, and an encapsulation provided on the substrate and the electrodes to accommodate and encapsulate the device therein, wherein the substrate and the encapsulation are made of a self-healing polymer (SHP), and wherein the electrodes are made of a conductive polymer composite including the SHP.

Dependencies are inferred from the claim text.