Semiconductor package and manufacturing method thereof

A semiconductor package, having a central region and a peripheral region disposed around the central region and extending from the central region to an edge of the semiconductor package, the semiconductor package comprising:

• first dies disposed in the central region;
• second dies disposed in the peripheral region;
• and
• an encapsulant, encapsulating the first dies and the second dies,
• wherein the first dies comprise first functional dies, and
• wherein the first functional dies are disposed along rows and columns of an array, and the first dies further include first dummy dies disposed along intersecting lines in between adjacent rows and columns of the first functional dies.

A manufacturing method of a semiconductor package, the method comprising:

• disposing first dies on a carrier;
• disposing second dies on the carrier beside the first dies;
• and
• molding the first dies and the second dies in an encapsulant;
• wherein, in the semiconductor package,
• the first dies are disposed in a first region of the semiconductor package;
• the second dies are disposed in a second region of the semiconductor package;
• wherein the first dies include third dies and fourth dies, and
• wherein disposing the first dies comprises:
• disposing the third dies on the carrier along rows and columns of an array;
• and
• disposing the fourth dies in between the rows and columns of the array,
• wherein a border between the first region and the second region is delimited by a perimeter of the array.