Electrochemical depositions of ruthenium-containing materials

A electroplating method comprising:

• depositing a seed layer in at least one opening formed in a patterned substrate, wherein the opening includes one or more sidewalls and a bottom surface;
• contacting the patterned substrate that includes the seed layer with an electrochemical plating fluid, wherein the electrochemical plating fluid comprises greater than or about 0.1 M ruthenium ions and greater than or about 1×10−5 M bismuth ions;
• and
• applying a current to the patterned substrate that includes the seed layer to plate a first portion of ruthenium-containing material on the bottom surface of the opening at a first deposition rate and a second portion of ruthenium-containing material on the sidewalls of the opening at a second deposition rate, wherein the first deposition rate is greater than the second deposition rate.