US 2023/0066375 A1 · APPARATUS INCLUDING DIRECT-CONTACT HEAT PATHS AND METHODS OF MANUFACTURING THE SAME

Abstract

Semiconductor devices including thermally conductive structures are disclosed herein. A heat transfer structure may be thermally coupled to a semiconductor device and directly attached to a signaling layer of a substrate. The heat transfer structure may be configured to remove thermal energy from the semiconductor device and transfer at least a portion of the removed thermal energy directly into the signaling layer for dissipation within the substrate, for transfer through the substrate and out of a corresponding apparatus, or a combination thereof.

Claims21

Dependent claims

An apparatus, comprising:

a substrate having a top surface, the substrate including a signaling layer at least partially exposed on or through the top surface, wherein the signaling layer is configured to route one or more electrical signals along a lateral direction;
a semiconductor device attached over the top surface, wherein the semiconductor device is electrically coupled to the signaling layer;
and
a heat transfer structure thermally coupled to the semiconductor device and directly attached to the signaling layer, the heat transfer structure configured to remove thermal energy from the semiconductor device and transfer at least a portion of the removed thermal energy to the signaling layer.

1 more element

A method of manufacturing an apparatus, the method comprising:

providing a semiconductor device;
providing a substrate having a top surface, the substrate including a signaling layer at least partially exposed on or through the top surface, wherein the signaling layer is configured to route one or more electrical signals along a lateral direction;
mounting the semiconductor device over the substrate;
and
attaching a heat transfer structure directly to the signaling layer and thermally coupled to the semiconductor device, wherein the heat transfer structure is configured to remove thermal energy from the semiconductor device and transfer at least a portion of the removed thermal energy to the signaling layer.

2 more elements

Dependencies are inferred from the claim text.

Facts

Application

17/412,604Filed 26 Aug 2021

Published

2 Mar 2023

Term ends

Not estimatedThe source records don’t support an estimate.

Classification15 codes

H10W 40/22
Arrangements for cooling: characterised by their shape, e.g. having conical or cylindrical projections
H10W 40/778
Auxiliary members characterised by their shape: in encapsulations
H10W 40/037
Of arrangements for cooling: assembling together parts thereof
H10W 40/10
Arrangements for thermal protection or thermal control: arrangements for heating

Apparatus including direct-contact heat paths and methods of manufacturing the same

Life of this patent

Apparatus including direct-contact heat paths and methods of manufacturing the same

Life of this patent

Abstract

Claims21