Semiconductor device and method of manufacturing the same

A method of manufacturing a semiconductor device, comprising:

• preparing a semiconductor unit including a semiconductor chip, and a cooling plate having a cooling front surface;
• forming a recess in the cooling front surface of the cooling plate and a projection that projects from a recess bottom surface of the recess in a lamination direction in which the cooling plate and the semiconductor unit are laminated inside the recess and that has an engagement surface parallel to the lamination direction and an inner surface opposite to the engagement surface, and
• tilting the projection so that the engagement surface is inclined at an acute angle with respect to the cooling front surface;
• after the forming and the tilting, mounting the semiconductor unit on the cooling front surface of the cooling plate, and a case along an outer edge of the cooling front surface at the outer edge via an adhesive so as to surround the semiconductor unit;
• and
• sealing the semiconductor unit disposed on the cooling plate inside the case with a sealing member.