Test apparatus for semiconductor package

An apparatus for a semiconductor package, configured to test a package-on-package type semiconductor package, comprising:

• an upper test socket on which an upper package is mounted, the upper test socket being mounted on a pusher and connected to a lower package placed therebelow;
• a lower test socket mounted on a tester and connected to the lower package placed thereabove;
• and
• an adsorption pad movably coupled to the pusher and configured to adsorb and pressurize the lower package using a vacuum pressure provided through the pusher,
• wherein the adsorption pad comprising:
• a body part having a vacuum pressure passage formed therein, and made of a silicon material;
• and
• an adsorption part having a diameter greater than that of the body part, having an adsorption hole formed at a position corresponding to the vacuum pressure passage, and made of any one of a polyimide film, engineering plastic, and synthetic resin,
• wherein the body part is attached on a central portion of an upper surface of the adsorption part and an outer oil overflow-preventing part configured to trap silicon oil eluted from the body part is formed at an outer periphery the adsorption part.