Semiconductor package and method of manufacturing the same

A semiconductor package comprising:

• a die stack structure comprising:
• a first die stacking over a second die;
• and
• a first encapsulant over the second die and laterally encapsulating the first die;
• a second encapsulant laterally encapsulating the die stack structure;
• conductive pillars disposed in the second encapsulant;
• a first redistribution structure disposed on a first side of the die stack structure, the conductive pillars and the second encapsulant;
• a second redistribution structure disposed on a second side of the die stack structure, the conductive pillars and the second encapsulant;
• and
• a solenoid inductor embedded in the first redistribution structure, the second redistribution structure and the second encapsulant therebetween.

A method of manufacturing a semiconductor package comprising:

• providing a first die and a second die;
• bonding the second die to the first die;
• forming a first encapsulant laterally surrounding the second die;
• forming a plurality of through vias in the first encapsulant;
• forming an interconnect structure on the second die, the plurality of through vias and the first encapsulant such that a die stack structure is formed;
• forming a second encapsulant laterally surrounding the die stack structure;
• and
• forming a redistribution structure over the die stack structure and the second encapsulant,
• forming an inductor in the interconnect structure and the redistribution structure, wherein the inductor comprises a portion of the interconnect structure and a portion of the redistribution structure.