Integrated circuit with backside conductive layers

An integrated circuit comprising a cell, comprising:

• a substrate;
• a first backside conductive layer formed over a backside of the substrate, the first backside conductive layer comprising a first plurality of conductive segments;
• and
• a second backside conductive layer formed over the first backside conductive layer and comprising a second plurality of conductive segments that are configured to transmit power signals, wherein:
• the first plurality and the second plurality of conductive segments cover select areas of the backside of the substrate to leave other areas of the backside of the substrate exposed;
• and
• one area of the backside of the substrate that is covered by the conductive segments comprises a power region of the cell.

A method, comprising:

• forming a first active diffusion (AD) region in a backside of a substrate;
• forming a second AD region in the backside of the substrate;
• forming a first backside conductive layer over the backside of the substrate that includes a first plurality of conductive segments;
• and
• forming a second backside conductive layer over the first backside conductive layer that includes a second plurality of conductive segments, wherein:
• the second plurality of conductive segments are configured to transmit power signals;
• and
• the first and the second conductive segments cover select areas of the backside of the substrate to leave other areas of the backside of the substrate exposed.