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US 2023/0065633 A1Published application
Thermally conductive label for circuit
AssigneeMicron Technology, Inc.
InventorsKaleb A. Wilson, Shams U. Arifeen, Bradley Russell Bitz, João Elmiro da Rocha Chaves, Mark A. Tverdy
Life of this patent
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Abstract
Various embodiments described herein provide a label configured for thermal conductivity and configured to pass over an edge of a printed circuit board (PCB) and attached to both sides of the printed circuit board. The label can be used with a printed circuit board that is associated with a memory sub-system, such as a memory module (e.g., solid state drive, SSD module).
Claims20
A memory module comprising:
- a printed circuit board having a first side and a second side;
- a set of memory components disposed on the first side;
- and
- a label attached to the printed circuit board, the label comprising:
- a first planar portion comprising a first thermal conduction layer;
- a first adhesive layer that attaches the first planar portion to the printed circuit board such that the first planar portion is disposed over the set of memory components on the first side;
- a second planar portion comprising a second thermal conduction layer;
- a second adhesive layer that attaches the second planar portion to the printed circuit board such that the second planar portion is disposed over the second side of the printed circuit board;
- and
- a plurality of tab portions in which each tab portion connects the first planar portion to the second planar portion, each tab portion passes over a single edge of the printed circuit board, and each tab portion comprises a separate thermal conduction layer that connects the first thermal conduction layer to the second thermal conduction layer.
7 more elements
A memory module comprising:
- a printed circuit board having a first side and a second side;
- a first set of memory components disposed on the first side;
- a second set of memory components disposed on the second side;
- and
- a label attached to the printed circuit board, the label comprising:
- a first planar portion comprising a first thermal conduction layer;
- a first adhesive layer that attaches the first planar portion to the printed circuit board such that the first planar portion is disposed over the first set of memory components on the first side;
- a second planar portion comprising a second thermal conduction layer;
- a second adhesive layer that attaches the second planar portion to the printed circuit board such that the second planar portion is disposed over the second set of memory components on the second side;
- and
- a plurality of tab portions in which each tab portion connects the first planar portion to the second planar portion, each tab portion passes over a single edge of the printed circuit board, and each tab portion comprises a separate thermal conduction layer that connects the first thermal conduction layer to the second thermal conduction layer.
8 more elements
A label comprising:
- a first planar portion comprising a first thermal conduction layer;
- a first adhesive layer configured to attach the first planar portion to a printed circuit board such that the first planar portion is disposed over a first side of the printed circuit board;
- a second planar portion comprising a second thermal conduction layer;
- a second adhesive layer configured to attach the second planar portion to the printed circuit board such that the second planar portion is disposed over a second side of the printed circuit board;
- and
- a plurality of tab portions in which each tab portion connects the first planar portion to the second planar portion, each tab portion is configured to pass over a single edge of the printed circuit board, and each tab portion comprises a separate thermal conduction layer that connects the first thermal conduction layer to the second thermal conduction layer.
3 more elements
Dependencies are inferred from the claim text.