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US 2023/0058727 A1Published application
Semiconductor device
AssigneeFuji Electric Co., Ltd.
InventorYuko NAKAMATA
Life of this patent
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Abstract
A semiconductor device is extremely reliable because a sealant thereof is difficult to deteriorate even when a SiC semiconductor element is energized. The semiconductor device is produced by sealing a SiC semiconductor element 11 mounted on a multilayer substrate 12 and electrically conductive connection members 14 and 18 with a sealant 20 containing an ultraviolet light absorbent.
Claims12
A semiconductor device comprising:
- a SiC semiconductor element mounted on a multilayer substrate and an electrically conductive connection member;
- and
- a sealant containing an ultraviolet light absorbent, which seals the SiC semiconductor element and the electrically conductive connection member.
Dependencies are inferred from the claim text.