Board structure, electronic apparatus, and method of manufacturing board structure

A method of manufacturing a board structure comprising:

• providing a heat generating element on a board;
• providing a heat sink on the board, the heat sink including a plate-shaped base member having one face being in contact with the heat generating element and a plurality of fins arranged side by side in a fin arrangement direction on an other face of the base member, the fins each extending in a flow direction in which cooling air flows, the fins each having a distal end at a downstream end in the flow direction;
• providing a first resisting member on a downstream side in the flow direction with respect to the heat sink, the first resisting member acting as a resistor for the cooling air to be exhausted;
• and
• providing a second resisting member on the downstream side in the flow direction and on a first side in the fin arrangement direction with respect to the heat sink, the second resisting member acting as a resistor for the cooling air to be exhausted,
• wherein the distal ends of the fins provided on a second side in the fin arrangement direction reside on an upstream side in the flow direction with respect to the distal ends of the fins provided on the first side.