Conductive Interconnects and Methods of Forming Conductive Interconnects

A conductive interconnect, comprising:

• a conductive liner lining a first opening in an insulative mass, the conductive liner establishing a second opening inside the first opening;
• a conductive plug partially filling the second opening leaving a cavity above an upper surface of the conductive plug, portions of the conductive liner extending elevationally above the upper surface of the conductive plug;
• an insulative collar within the cavity against the portions of conductive liner and against a portion of the upper surface of the conductive plug leaving an exposed upper surface portion of the conductive plug;
• and
• a plurality of vertically-extending interconnects over the insulative mass with at least one vertically-extending interconnect contacting the exposed upper surface portion of the conductive plug.

A conductive interconnect, comprising:

• an opening extends through an insulative mass to an upper surface of a first conductive structure;
• a conductive plug within the opening and in electrical contact with the upper surface of the first conductive structure;
• a substantially planar surface extending across the insulative mass;
• a cavity in the insulative mass over the conductive plug;
• an insulative spacer within the cavity to narrow the cavity, an upper surface of the conductive plug being exposed at a bottom of the narrowed cavity;
• and
• a conductive expanse over the insulative mass, a first portion of the conductive expanse extends into the cavity and is configured as a vertically-extending interconnect.

An integrated assembly, comprising:

• an opening extending through an insulative mass to an upper surface of a first conductive structure;
• a liner material within the opening to line sidewalls of the opening;
• a core material within the opening and along the lined sidewalls of the opening;
• a substantially planar surface extending across the insulative mass, the liner material and the core material;
• a cavity over the core material;
• an insulative spacer within the cavity to narrow the cavity, an upper surface of the core material being exposed at a bottom of the narrowed cavity;
• a conductive expanse over the insulative mass, a portion of the conductive expanse extending into the cavity and being configured as a vertically-extending interconnect;
• and
• multiple second conductive structures;
• one of said second conductive structures including the vertically-extending interconnect and being electrically coupled to the first conductive structure through the core material and the vertically-extending interconnect.