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US 2023/0058025 A1Published application
Scandium precursor for sc2o3 or sc2s3 atomic layer deposition
AssigneeIntel Corporation
InventorPatricio E. ROMERO
Life of this patent
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Abstract
Described are precursor compounds and methods for atomic layer deposition of films containing scandium(III) oxide or scandium(III) sulfide. Such films may be utilized as dielectric layers in semiconductor manufacturing processes, particular for depositing dielectric films and the use of such films in various electronic devices.
Claims13
A compound having the structural formula:
- wherein R3 is a group different from an R1—CH2— group.
Dependencies are inferred from the claim text.