Semiconductor module

A semiconductor module, comprising:

• a substrate having a first main surface and a second main surface on a side opposite to the first main surface;
• a semiconductor device mounted on the first main surface;
• and
• a heat sink attached to the second main surface via an insulation member having a thermal conductivity, wherein
• the substrate includes a first through hole passing from the first main surface to the second main surface,
• the semiconductor device includes a plurality of electrodes exposed from a surface facing the first main surface and a protrusion formed between the plurality of electrodes to be inserted through the first through hole,
• the insulation member is formed so that a length in a thickness direction of the substrate is smaller than a length of a tip end portion of the protrusion protruding from the first through hole, and
• a groove in which the tip end portion of the protrusion is housed via the insulation member is formed in a surface of the heat sink facing the insulation member.