Semiconductor chip

A semiconductor chip comprising:

• a chip body that has a first side surface, a second side surface opposite the first side surface, a third side surface extending between the first side surface and the second side surface, and a fourth side surface extending between the first side surface and the second side surface and opposite the third side surface;
• a central region at a central portion of the chip body;
• and
• a peripheral region at a peripheral portion of the chip body and adjacent to at least one of the first side surface to the fourth side surface,
• wherein the peripheral region comprises a plurality of first unit regions that include a plurality of first bumps of a first bump density, and a plurality of second unit regions that include a plurality of second bumps of a second bump density higher than the first bump density, and
• wherein the first unit regions and the second unit regions are sequentially and repeatedly arranged along at least one of the first side surface to the fourth side surface.

A semiconductor chip comprising:

• a chip body that has a first side surface, a second side surface opposite the first side surface, a third side surface extending between the first side surface and the second side surface, and a fourth side surface extending between the first side surface and the second side surface and opposite the third side surface;
• a central region at a central portion of the chip body;
• and
• a first peripheral region to a fourth peripheral region respectively adjacent to the first side surface to the fourth side surface,
• wherein the first peripheral region to the fourth peripheral region each comprise a first unit region that includes a plurality of first bumps of a first bump density, and a second unit region that includes a plurality of second bumps of a second bump density higher than the first bump density, and
• wherein the central region comprises a plurality of third bumps of a third bump density equal to the second bump density.