Core substrate, package structure including the core substrate, and method of manufacturing semiconductor package

A package structure comprising:

• a core substrate including a substrate base that includes a plurality of first cavities and a plurality of second cavities, a plurality of blocks in the plurality of second cavities, and a plurality of bridge structures that extend between each of the plurality of blocks and the substrate base;
• a plurality of semiconductor chips in the plurality of first cavities;
• and
• a molding layer that covers the core substrate and the plurality of semiconductor chips, a portion of the molding layer is in the plurality of first cavities and the plurality of second cavities,
• wherein the substrate base, the plurality of blocks, and the plurality of bridge structures include the same material as each other,
• each of the plurality of blocks has a quadrangular shape in a plan view, and
• the plurality of bridge structures include at least one first bridge structure that extends from a first edge of each of the plurality of blocks to the substrate base and at least one second bridge structure that extends from a second edge of each of the plurality of blocks to the substrate base.

A core substrate comprising:

• a substrate base in a quadrangular panel shape that includes a plurality of first cavities and a plurality of second cavities;
• a plurality of blocks in the plurality of second cavities;
• and
• a plurality of bridge structures that extends between each of the plurality of blocks and the substrate base.