Sidewall Connections and Button Interconnects for Molded SiPs

An electronic module comprising:

• a system-in-package including:
• a routing substrate;
• a first electronic component mounted on a first side of the routing substrate and encapsulated in a first molding compound layer;
• and
• a socket connector housing mounted on the routing substrate and within a cavity in the first molding compound layer, the socket connector housing including a side receptacle opening;
• wherein the cavity is exposed along a first side surface of the first molding compound layer;
• a flexible circuit extending into the cavity from outside the first molding compound layer and connected inside the side receptacle opening of the socket connector housing.