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US 2023/0056907 A1Published application
Fluidic dies with thermal sensors on membrane
AssigneeHewlett-Packard Development Company, L.P.
InventorsEric T. Martin, Jeremy Joseph Spencer, Donald J. Milligan
Life of this patent
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Abstract
A fluidic die includes a substrate and a thermal sensor arranged on a membrane region of the substrate. The substrate includes a fluid slot formed in a back side of the substrate, while the membrane region is positioned between the fluid slot and a front side of the substrate. The substrate also includes a plurality of fluid feed holes in the membrane region, where each fluid feed hole is in communication with the fluid slot and the front side of the substrate.
Claims15
A fluidic die, comprising:
- a substrate, comprising:
- a fluid slot formed in a back side of the substrate;
- a membrane region positioned between the fluid slot and a front side of the substrate;
- and
- a plurality of fluid feed holes in the membrane region, each fluid feed hole in communication with the fluid slot and the front side of the substrate;
- and
- a thermal sensor arranged on the membrane region of the substrate.
4 more elements
A thermal inkjet printing system, comprising:
- a fluidic die, comprising:
- a fluid slot formed in a back side of a substrate;
- a membrane region between the fluid slot and a front side of the substrate;
- and
- an actuator in fluid communication with the fluid slot via a fluid feed hole in the membrane region;
- and
- a heating system arranged on the die to maintain a temperature profile across a surface of the die through selective application of heat to different areas of the die in response to temperature data sensed at different areas of the die, the heating system comprising a plurality of heating elements and a plurality of thermal sensors including a thermal sensor arranged on the membrane region.
4 more elements
A method, comprising:
- receiving temperature data from a thermal sensor arranged on a membrane region, the membrane region between a slot formed in a back side of a fluidic die substrate and a front side of the fluidic die substrate;
- and
- controlling heating elements arranged on the fluidic die substrate based on the temperature data to maintain a temperature profile across a surface of the fluidic die substrate by selectively applying heat to different areas of the substrate.
Dependencies are inferred from the claim text.