Semiconductor device

Abstract

A semiconductor device includes: a semiconductor element; a support member; a bonding layer interposed between the semiconductor element and the support member; and a sealing resin that covers the semiconductor element and at least a portion of the support member, wherein the bonding layer is a layer in which a layer containing first metal and a layer containing second metal are integrated without going through a molten state, and wherein the support member includes a first surface facing in a thickness direction and facing a side on which the semiconductor element is located, and a plurality of first recesses located outside the bonding layer and recessed from the first surface when viewed along the thickness direction.

Dependencies are inferred from the claim text.