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US 2023/0056579 A1Published application
Apparatus including integrated pads and methods of manufacturing the same
AssigneeMicron Technology, Inc.
InventorsWei Zhou, Thiagarajan Raman
Life of this patent
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Abstract
Semiconductor devices including electrically-isolated extensions and associated systems and methods are disclosed herein. An electrically-isolated extension may be coupled to a corresponding connection pad that is attached to a surface of a device. The electrically-isolated extensions may extend at least partially through one or more layers at or near the surface and toward a substrate or an inner portion thereof.
Claims20
An apparatus, comprising:
- a semiconductor substrate, wherein the semiconductor substrate corresponds to a semiconductor wafer;
- a passivation layer covering a backside of the semiconductor substrate, wherein at least a portion of a surface of the passivation layer comprises a surface of the semiconductor substrate;
- a connection pad disposed over the passivation layer of the semiconductor substrate;
- and
- an extension directly coupled to the connection pad and extending from the connection pad into the passivation layer, wherein the extension and the connection pad are electrically isolated from the semiconductor substrate.
2 more elements
A semiconductor device, comprising:
- a semiconductor substrate, wherein the semiconductor substrate corresponds to a semiconductor wafer;
- active circuitry formed on a frontside of the semiconductor substrate;
- an electrical pad over a backside of the semiconductor substrate and electrically coupled to the active circuitry, wherein the electrical pad is configured to provide an external electrical interface for the active circuitry in the semiconductor device;
- a thermal pad over the backside to the semiconductor substrate and electrically isolated from the active circuitry and the semiconductor substrate, wherein the thermal pad is configured to provide an external thermal interface for removing thermal energy from the semiconductor device;
- and
- an extension coupled to the thermal pad and extending from the thermal pad and toward an inner portion of the semiconductor substrate, wherein the extension is electrically isolated from the active circuitry and the semiconductor circuitry.
3 more elements
A method of manufacturing a semiconductor device, the method comprising:
- providing a semiconductor substrate having active circuitry on a frontside of the semiconductor substrate;
- forming a protective outer layer over a backside of the semiconductor substrate;
- forming a depression extending at least partially through the protective outer layer and toward the semiconductor substrate;
- forming an electrically-isolated extension in the depression, wherein the electrically-isolated extension is electrically isolated from the active circuitry;
- and
- attaching a connection pad over the protective outer layer and coupled to the electrically-isolated extension.
3 more elements
Dependencies are inferred from the claim text.