Semiconductor package structure including antenna

An electronic device, comprising:

• a redistribution (RDL) structure having a first surface and a second surface opposite the first surface;
• a first electronic component having an active surface formed on the first surface of the RDL structure;
• a plurality of first electrical connectors formed on the second surface of the RDL structure;
• an insulating substrate having a first surface stacked on the second surface of the RDL structure;
• a conductive pattern layer comprising a first antenna element, formed in the insulating substrate and adjacent to the first surface of the insulating substrate;
• a second antenna element formed on a second surface of the insulating substrate opposite the first surface of the insulating substrate;
• and
• a plurality of second electrical connectors formed on the first surface of the insulating substrate and electrically connected to the first antenna element, wherein the plurality of second electrical connectors is larger than the plurality of first electrical connectors.