Lead frame and electronic component

A lead frame for an electronic component, comprising:

• a die pad;
• a plurality of leads;
• at least one support lead;
• and
• a frame member configured to surround the die pad, the plurality of leads, and the at least one support lead, wherein:
• the frame member includes a first connection bar extending in a first direction and a second connection bar extending in a second direction;
• the plurality of leads include a plurality of specific leads arranged along the first connection bar;
• the plurality of specific leads are each connected to the first connection bar;
• at least one of the specific leads is connected to the second connection bar via the at least one support lead;
• and
• a cross-sectional second-order moment of a cross section of the at least one support lead perpendicular to the first direction around an axis parallel to the second direction is equal to or more than a cross-sectional second-order moment of a cross section of the at least one support lead perpendicular to the second direction around an axis parallel to the first direction.