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US 2023/0055987 A1Published application
Planar coil, and device for manufacturing semiconductor comprising same
AssigneeKYOCERA Corporation
InventorTakeshi MUNEISHI
Life of this patent
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Abstract
A planar coil (10) of the present disclosure includes a base (1) including a first surface (1a), a metal layer (2) located on the first surface (1a) and including a through hole (2a) and a plurality of voids (3), and a first fixing tool (8) inserted through the through hole (2a) and fixing the metal layer (2) to the first surface (1a) side of the base (1).
Claims19
A planar coil comprising:
- a base comprising a first surface;
- a metal layer located on the first surface and comprising a through hole and a plurality of voids;
- and
- a first fixing tool inserted through the through hole and fixing the metal layer to the first surface side of the base.
1 more element
Dependencies are inferred from the claim text.