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AssigneeTokyo Electron Limited
InventorsIvan MALEEV, Shin-Yee LU, Dimitri KLYACHKO, Ching Ling MENG, Xinkang TIAN
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A method of manufacturing semiconductor devices includes repeatedly performing a transfer operation which transfers each of a plurality of semiconductor wafers between a substrate handling module and a processing chamber through a wafer access port, the processing chamber including at least one consumable component. Using the processing chamber, a semiconductor manufacturing process is performed on each of the plurality of semiconductor wafers; and detecting an optical signal from the at least one consumable component during a time when the processing chamber is not performing the semiconductor manufacturing process on the wafers.
A method of manufacturing semiconductor devices, comprising:
A method of detecting a state of a consumable component in a semiconductor processing chamber, the method comprising:
Dependencies are inferred from the claim text.