Image pickup device and electronic apparatus

An electronic apparatus, comprising:

• an image pickup device, comprising:
• a first structural body and a second structural body that are layered, wherein the first structural body includes an effective pixel region having photodiodes, and wherein the second structural body is positioned below the first structural body;
• and
• a lens module provided above the first structural body,
• wherein a protective substrate is provided between the lens module and the first structural body,
• wherein the protective substrate is a transparent substrate,
• wherein a width of the protective substrate is substantially the same as a width of the lens module,
• wherein the protective substrate is fixed above an upper surface of the first structural body via a resin layer, and
• wherein the resin layer is disposed between the protective substrate and the effective pixel region of the first structural body;
• and
• a circuit board coupled to a bottom surface of a semiconductor substrate constituting a part of the second structural body.

A method of manufacturing an image pickup device, comprising:

• layering a first structural body onto a second structural body,
• wherein the first structural body includes an effective pixel region having photodiodes, and
• wherein the second structural body is positioned below the first structural body;
• providing a lens module above the first structural body;
• and
• providing a protective substrate between the lens module and the first structural body,
• wherein the protective substrate is a transparent substrate,
• wherein a width of the protective substrate is substantially the same as a width of the lens module,
• wherein the protective substrate is fixed above an upper surface of the first structural body via a resin layer, and
• wherein the resin layer is disposed between the protective substrate and the effective pixel region of the first structural body.