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US 2023/0055518 A1Published application
Solder Ball Application for Singular Die
AssigneeGlobal Circuit Innovations Inc.
InventorErick Merle Spory
Life of this patent
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Abstract
A device is provided. The device includes one or more of a singular die, one of another die, a printed circuit board, and a substrate, and one or more solder balls. The singular die includes one or more reconditioned die pads, which include die pads of the singular die with a plurality of metallic layers applied. The other die, printed circuit board, and the substrate include one or more bond pads. The one or more solder balls are between the one or more reconditioned die pads and the one or more bond pads.
Claims12
A device, comprising:
- a singular die, comprising:
- one or more reconditioned die pads, wherein reconditioned die pads comprises die pads of the singular die with a plurality of metallic layers applied;
- and
- one of another die, a printed circuit board, and a substrate, comprising:
- one or more bond pads;
- and
- one or more solder balls between the one or more reconditioned die pads and the one or more bond pads.
4 more elements
Dependencies are inferred from the claim text.