Component Carrier With Embedded Semiconductor Component and Embedded Highly-Conductive Block Which are Mutually Coupled

A method of manufacturing a component carrier, the method comprising:

• forming a stack comprising at least one horizontal electrically conductive layer structure and at least one electrically insulating layer structure;
• embedding a semiconductor component in the stack;
• and
• forming at least one vertical via being laterally offset from the semiconductor component;
• wherein the at least one horizontal electrically conductive layer structure electrically connects the vertical via to a bottom main surface of the semiconductor component;
• wherein the component carrier is configured for a current flow from the vertical via to the horizontal electrically conductive layer structure, from the horizontal electrically conductive layer structure to the bottom main surface of the semiconductor component, from the bottom main surface of the semiconductor component to an upper main surface of the semiconductor component, and from the upper surface of the semiconductor component to the outside of the component carrier.

A method, comprising:

• providing a component carrier with a stack comprising at least one horizontal electrically conductive layer structure and at least one electrically insulating layer structure;
• a semiconductor component embedded in the stack;
• at least one vertical via being laterally offset from the semiconductor component;
• wherein the at least one horizontal electrically conductive layer structure electrically connects the vertical via to a bottom main surface of the semiconductor component;
• and
• conducting a current flow of at least 100 Ampere, in particular in a range between 100 Ampere and 10000 Ampere, wherein the current flow is from the vertical via to the horizontal electrically conductive layer structure, from the horizontal electrically conductive layer structure to the bottom main surface of the semiconductor component, from the bottom main surface of the semiconductor component to an upper main surface of the semiconductor component, and from the upper surface of the semiconductor component to the outside.