Thermal interface layer

A thermal interface layer comprising pluralities of first and second particles dispersed in a polymeric binder at a total loading V in a range of about 40 volume percent to about 70 volume percent, the first and second particles having different compositions, the first particles comprising one or more of iron or nickel, the second particles comprising one or more of aluminum, magnesium, silicon, copper, or zinc, wherein the thermal interface layer has a thermal conductivity in a thickness direction of the thermal interface layer in units of W/mK of at least K=5.1-0.17 V+0.002 V2.

A thermal interface layer comprising pluralities of first and second particles at a total volume loading in a range of about 40 percent to about 70 percent, a ratio of a total volume of the first particles to a total volume of the first and second particles being in a range of about 0.04 to about 0.1, the first and second particles having respective real parts of relative magnetic permeability μ′1 and μ′2 such that for at least one frequency less than about 1 GHz, μ′1/μ′2≥5, wherein the second particles are at least partially aligned so as to increase a thermal conductivity of the thermal interface layer in a thickness direction of the thermal interface layer by at least 10 percent.

A thermal interface layer comprising a plurality of alternating substantially continuous layers of magnetically responsive first and thermally conductive second particles, the alternating layers generally extending along orthogonal first and second directions and arranged along a third direction, the first and second particles having different compositions, the second particles having a thermal conductivity of at least 10 W/mK.