US 2023/0055073 A1 · SEMICONDUCTOR STRUCTURE MANUFACTURING METHOD AND SEMICONDUCTOR STRUCTURE

Abstract

The embodiments of the present application belong to the technical field of semiconductor manufacturing, and relate to a semiconductor structure manufacturing method and a semiconductor structure. The semiconductor structure manufacturing method includes: the substrate is provided with a plurality of active area structures and a plurality of first hole structures arranged at intervals, first bonding pad structures are formed in the first hole structures, and the first bonding pad structures are electrically connected to the active area structures; and second bonding pad structures are formed on the first bonding pad structures, and the second bonding pad structures are connected to the first bonding pad structures, and connected to a capacitor structure.

Claims16

Dependent claims

A semiconductor structure manufacturing method, comprising:

providing a substrate, wherein the substrate comprises a plurality of active area structures and a plurality of first hole structures distributed at intervals;
forming first bonding pad structures in the first hole structures, wherein surfaces, away from the substrate, of the first bonding pad structures are flush with the substrate, and the first bonding pad structures are electrically connected to the active area structures;
and
forming second bonding pad structures on the first bonding pad structures, wherein the second bonding pad structures are connected to the first bonding pad structures, and the second bonding pad structures are connected to a capacitor structure.

1 more element

Dependencies are inferred from the claim text.

Semiconductor structure manufacturing method and semiconductor structure

Life of this patent

Semiconductor structure manufacturing method and semiconductor structure

Life of this patent

Abstract

Claims16