Basic structural body for constructing heat dissipation device and heat dissipation device
AssigneeAsia Vital Components Co., Ltd.
InventorKuei-Feng Chiang
Life of this patent
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Abstract
A basic structural body for constructing heat dissipation device and a heat dissipation device are disclosed. The heat dissipation device includes a first basic structural body having a wick structure formed on one side surface thereof; and the first basic structural body and the wick structure are structural bodies formed layer by layer. Two pieces of first basic structural bodies can be correspondingly closed together to construct a heat dissipation device internally defining an airtight chamber. In this manner, the heat dissipation device can be designed in a more flexible manner.
Claims6
A heat dissipation device, comprising:
- a plurality of first basic structural bodies, which respectively have a wick structure formed on one side surface thereof;
- the first basic structural body and the wick structure thereof being structural bodies formed layer by layer, and the basic structural bodies being correspondingly closed together in pairs to construct the heat dissipation device that internally defines an airtight chamber;
- and a working fluid being filled in the airtight chamber.
Dependencies are inferred from the claim text.